March, 2008
Silyb Introduces TSV Test Wafers

Silyb is proud to introduce the industries first standardized test mask for TSV development. Available in CMP integration, Etch or Cu dep configurations. See our products page for more info.

March, 2008
300mm BDIIx Porous Ultra Low k Films Available Now

Silyb is happy to introduce 300mm BDIIx films. The k value on these cutting edge Porous SIOC films is 2.4 with a porosity around 25%. Please contact us on our contact page for more information.

December, 2007
Plasma Damage Wafers for Yield Improvement

Silyb is pleased to add 200 and 300mm Plasma Damage Wafers. Please contact us for more information on the uses and costs for this important yield improvement tool.

November, 2007
Silyb 300mm Metrology Services

Your customers ask more from you every day. To answer the needs of advanced CMP development, Silyb is proud to offer 300mm Metrology Services. These services include advanced defect analysis and classification, profilometry, AFM measurments and more! Please check under Services/300mm Services for more information. Silyb... The Total Test Wafer Solution

October, 2007
4x lower Defects with Silyb 300mm Cu Patterns!

Breaking News! A major CMP consumables mfg has finished initial qualifications of Silyb's 300mm Cu/Oxide 854 Patterned wafers. Results showed a 4x decrease in defects over their current supplier of 300mm 854 patterned wafers. If a competitive advantage like this is important to you, contact us!

August, 2007
Silyb Introduces 300mm SACVD and HDP 864 STI Patterns

We've been disappointed with many of our competitors methods of building these wafers to date. Many of them have the photo/etch done in one location and the deposition in another. This results in more variation and generally lower quality. Silyb pushed our foundry partners to make these industry standard test wafers in one place and on cutting edge tool sets. The quality is fantastic and we look forward to answering your questions about these exciting new products.

August, 2007
Silyb Introduces 300mm TEOS Capped Black Diamond MIT854 Pattern Wafers

Silyb is proud to introduce 300mm TEOS capped BD MIT854 pattern wafers. These wafers are made by a 45nm 300mm IC maker in Japan, so the quality is unsurpassed. If you're tired of dealing with lot-to-lot defect and planarization variation on your currently supplied wafers, give us a call to discuss how life could be, using our wafers!

August, 2007
300mm Low Cost Cu MIT854 Patterned Wafers

Silyb has listened to the market and understands that the costs of R&D are very high. We have worked with our global fab network to drive down the cost of patterned wafer production and are proud to bring you high quality 300mm MIT854 patterned wafers for less! Please contact us for more information!

January, 2007
Silyb SCONWTEOS and SCONWSIONTEOS improves W Slurry Development

Silyb is proud to announce the addition of a specifically designed Contact test wafers for W and Poly Si processes. This reticle answers the vexing question of contact size dependece and density dependence of various processes. The wafer was designed to allow complete understanding of pattern density effects and hole size effects including SRAM and Bond Pad Arrays. Please contact us for more information

January, 2007
Silyb Customer Support Makes the Difference

In recent years, customer support has continued to get worse and worse. Not so at Silyb. We pride ourselves in helping our customers quickly resolve their development problems. A large Cu CMP barrier slurry development manager was quoted "What would we do without you!" as Silyb helped them to create specific low-k wafers to answer a development need. Another large CMP pad manufacturer development manager was quoted "We can just focus on our development knowing that if we need something Silyb will be there to help". If you need a partner in development that will help you to reduce costs, improve the quality of your testing and support you with data and unique solutions in times of crisis, give Silyb a call.

January, 2007
Silyb Innovations reduce the cost of pattern wafers

In response to the growing need to reduce R&D costs in the semiconductor market, Silyb has engineered a way to maintain the high quality our customers have come to expect and reduce the cost of R&D. "By reducing the costs and maintaining the quality Silyb has allowed our customers to stretch their R&D dollars", said James Bopp, President of Silyb Wafer Services. Please contact Silyb for more information.

December, 2006
200mm 90nm Cu/Low k Fab Foundry Services

Silyb has been offering 200mm Foundry services since May of 2005. This service is available for all types of processes. We have performed post CMP cleaner and brush testing. Post Barrier Break Through etch cleaner testing and post ash clean testing has also been performed. These customers picked Silyb for their develpment needs because of our advanced tool sets and engineering know how. Give us a call to find out more.

January, 2005
STI Characterization with Planarization and Defectivity in one

Silyb is proud to introduce a new 200mm STI Characterization Wafer. Silyb has combined planarization features and defect features in a way that the feature sets do not interact on the wafer. This test wafer innovation reduces test wafer costs by eliminating the need for two wafers to characterize STI development activities. Contact Silyb Wafer Services for more information.