CMP - 200mm W

S854WTEOS: W/TEOS MIT854 Patterned Wafer

180nm MIT854 W Interconnect Wafer with TEOS ILD

SCONWTEOS: Advanced CMP/Etch Contact Test Wafer

Large variety of contact sizes and densities optimized for CMP and Etch development.

• Please contact Silyb Wafer Services for detailed stack information.

SJ085WTEOS

160nm W Advanced Contact Wafers

• Device Manufacturer Test Chip Design
• Multiple Areas to investigate CMP, Etch, or Lithography

SK194WTEOS: W/TEOS 90nm Advanced Interconnect Patterned Wafer

120nm minimum feature W Interconnect Characterization Wafer with TEOS ILD.

• TEOS ILD