Total Test Wafer Solutions
Home
About Us
Products
CMP
CMP - 200mm Cu
CMP - 300mm Cu
CMP - 200mm W
CMP - 300mm W
CMP - 200mm STI/ILD
Custom Products
Contact
Advanced Packaging (3D-IC's)
Home
Products
Advanced Packaging (3D-IC's)
Request Information
SNANDTEOS: 3D Nand Integration Test Wafer
3D NAND Integration, mm scale features
0.5mm – 10mm features
2um trenches with 3um of TEOS fill
Request Information