S854WTEOS: W/TEOS MIT854 Patterned Wafer
180nm MIT854 W Interconnect Wafer with TEOS ILD
SCONWTEOS: Advanced CMP/Etch Contact Test Wafer
Large variety of contact sizes and densities optimized for CMP and Etch development.
- Please contact Silyb Wafer Services for detailed stack information.
160nm W Advanced Contact Wafers
- Device Manufacturer Test Chip Design
- Multiple Areas to investigate CMP, Etch, or Lithography
SK194WTEOS: W/TEOS 90nm Advanced Interconnect Patterned Wafer
120nm minimum feature W Interconnect Characterization Wafer with TEOS ILD.
- TEOS ILD