S854WTEOS: W/TEOS MIT854 Patterned Wafer

180nm MIT854 W Interconnect Wafer with TEOS ILD

SCONWTEOS: Advanced CMP/Etch Contact Test Wafer

Large variety of contact sizes and densities optimized for CMP and Etch development.

  • Please contact Silyb Wafer Services for detailed stack information.


160nm W Advanced Contact Wafers

  • Device Manufacturer Test Chip Design
  • Multiple Areas to investigate CMP, Etch, or Lithography

SK194WTEOS: W/TEOS 90nm Advanced Interconnect Patterned Wafer

120nm minimum feature W Interconnect Characterization Wafer with TEOS ILD.