Services

Full 200mm 90nm Cu/Low-k fab available for your testing needs

Many process modules available. Etch, 193nm Lithography, CMP, Metallizaiton, Thin Films etc…

Veeco Vx 200mm Atomic Force Profilometry

High resolution dishing and erosion measurements from industry standard tool set.

300mm Defect Capture and Review on Cu, W or STI wafers. Report with 50 classified optical and SEM images included.

CMP Polishing Services available from 4 through 12 inch wafers. Please Inquire.

Applied Materials Mirra 200mm, IPEC 472, Ebara FREX 200mm all available for your polishing needs

CMP Polishing Services available from 4 through 12 inch wafers. Please Inquire.

200mm Sheet or Patterned wafers measured for defects.

Wafers measured on KLA2139 brightfield, AITxp or SP-1 defect measurement tool.
Defect Review with Optical Microscope and SEM images provided for defect classification.
90nm Device Fab Yield Engineer classifications of defects based on fab’s defect library.
Sample Report available by request, or login to download
EDX chemical constituent analysis available
AFM defect morphology analysis available

Measurement of the resistance and capacitance for metalized wafers.

Report with all data summarized graphically.
Report grouping is configurable by the customer.
Probe cards and recipes available for all Silyb pattern wafers, inquire for other pattern wafer designs
Contact us for sample reports, or login to download.

300mm Metrology Services available, please inquire for more information.

KLA F5x measurement services

Measurement services for transparent film stacks or metal films.